The rapid growth of electric vehicles (EVs) is placing unprecedented demands on electronics that manage power conversion, battery performance, and thermal stability. Traditional semiconductor materials, even advanced wide bandgap options such as silicon carbide (SiC) and gallium nitride (GaN), are reaching their limits as EV systems push for higher efficiency, faster charging, and more compact designs. Read more

Gallium Nitride (GaN) has established itself as a cornerstone in high-performance electronics due to its wide bandgap, high switching speeds, and excellent power-handling capabilities. Yet, as devices scale to higher power densities, thermal limitations continue to constrain their performance. Read more

Modern semiconductor devices are demanding more from their cooling materials than ever before. With power densities soaring and thermal bottlenecks threatening performance, the choice of materials for thermal management is critical. While pure diamond offers the highest thermal conductive material properties, it remains costly for widespread adoption. Read more

High-power electronics are facing thermal challenges at levels previously unseen. As device architectures scale for higher performance, power densities now exceed 10 kW/cm²—hundreds of times greater than those in digital electronics.Traditional heat management solutions using copper or aluminum heat sinks are reaching their physical limits. Read more

5G networks require semiconductors that can handle higher power densities, faster data transmission, and extremely demanding operating conditions. Although traditional semiconductor materials are currently meeting the on-par requirements, they are not viable for drastic improvements in the field. Read more

High-power electronics involve high working temperatures, huge currents, and rapid switching which demand high-performance semiconductor materials. The industry standard Silicon Carbide (SiC) and Gallium Nitride (GaN) semiconductors are good, cost-effective, and easily reliable. Read more