The artificial intelligence revolution has brought an unexpected crisis: modern AI accelerators and GPUs are literally melting under their own computational ambitions. NVIDIA's latest H100 and H200 GPUs consume upwards of 700 watts, while upcoming generations promise to push beyond 1,000 watts per chip. Read more

The semiconductor industry stands at a thermal precipice. For decades, Moore's Law drove exponential increases in transistor density, delivering more powerful chips with each generation. Today, however, we face a sobering reality: the primary barrier to continued performance scaling is no longer transistor physics or manufacturing precision it's heat. Read more

The explosive growth of 5G networks, satellite communications, and advanced radar systems has created an insatiable demand for radio frequency power amplifiers that can deliver more output from smaller packages. Gallium nitride (GaN) has emerged as the semiconductor of choice for these applications, offering superior power density, efficiency, and frequency response compared to legacy technologies. Read more

Electric vehicles have conquered range anxiety through larger batteries and expanded charging networks, but a new bottleneck has emerged: thermal management during high-power charging. When a 100 kWh battery pack charges at 350 kW necessary to achieve the coveted 10-minute charging sessions the power electronics generate tremendous heat that stresses components, triggers thermal throttling, and limits charging speeds precisely when drivers want maximum performance. Read more

The race to dominate high-power electronics has intensified dramatically as electric vehicles, renewable energy systems, and 5G infrastructure demand components that operate at higher voltages, temperatures, and switching frequencies than ever before. Silicon has reached its fundamental limits for these applications, prompting a shift to wide-bandgap semiconductors. Silicon carbide (SiC) and gallium nitride (GaN) have emerged as commercial winners, capturing billions in market value. Read more

The relentless march toward more powerful semiconductors has created an emerging crisis in thermal management. As chips grow denser and power requirements escalate, traditional cooling solutions are reaching their physical limits. Enter diamond cooling a revolutionary approach that leverages the extraordinary thermal properties of synthetic diamonds to dissipate heat in ways previously thought impossible. Read more

Pure diamond offers unmatched thermal conductivity exceeding 2,000 W/mK, but costs $500-2,000 per heat spreader prohibitive for most applications. Metal-diamond composites solve this dilemma by embedding diamond particles in copper or aluminum matrices, delivering 2-3x better thermal performance than pure metals at a fraction of pure diamond's cost. Read more

As electronic devices become smaller, faster, and more powerful, managing heat and ensuring long-term reliability have emerged as two of the biggest engineering challenges. Traditional materials such as silicon, copper, and silicon carbide are increasingly being pushed to their physical limits. Read more

Diamond wafers are rapidly moving from research laboratories into real-world semiconductor manufacturing. Once considered an exotic material, CVD (Chemical Vapor Deposition) diamond is now gaining traction because modern electronics are hitting fundamental limits in heat dissipation, power density, and reliability. Read more

Diamond is no longer “just” a gemstone or an industrial abrasive. Over the last few years, electronic-grade CVD diamond has been moving into a high-value niche of the semiconductor supply chain especially where heat, power density, and reliability are the limiting factors. Read more