Cu-Diamond Composite Material for Heat Management

Specifications

  • Thermal conductivity: 500–700 W/m·K
  • CTE tailored to match Si or GaN
  • Thickness: 0.5 mm – 5 mm or as per customised design
  • Surface: Lapped, Laser Cut
Cu-Diamond Composite Material for Heat Management

Applications

  • High-power RF amplifier baseplates
  • IGBT module heat sinks
  • Space-grade thermal interface materials
  • LED packaging

Industries

  • Power Electronics
  • Automotive EV Modules
  • Satellite and Defense Avionics
  • LED Packaging

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