Aluminium-Diamond Composite Plates
Specifications
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Diamond volume fraction: 30–50%
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Thermal conductivity: 350–500 W/m·K
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CTE matched with Si or GaAs
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Surface treatment: Lapped, Laser Cut
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Thickness: 0.3 mm – 10 mm or as per customised design
Applications
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Heat spreaders in telecom and radar
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Laser diode mounting
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Optoelectronic devices thermal management
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LED arrays
Industries
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Telecom Infrastructure
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Consumer Electronics
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Medical Lasers
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Aerospace Electronics
DIAMOND SEMICON